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TMUX1119DBVR - Texas Instruments

Description: Analog Switch ICs 3-pA, 5-V, 2:1 (SPDT), 1-channel precision multiplexer

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PCB Footprints
TMUX1119DBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A SOT-23 - 1.45 mm max height
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3D Models
TMUX1119DBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A SOT-23 - 1.45 mm max height
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TMUX1119DBVR Details

  • Manufacturer Part Number:

    TMUX1119DBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-12-22

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    250 MHz

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • On-state Resistance-Max (Ron):

    4.9 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.0014 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.08 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TMUX1119DBVR Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the TMUX1119DBVR is 100 MHz.
  • To ensure signal integrity, use a low-impedance PCB design, minimize trace lengths, and use a common ground plane. Additionally, consider using a termination resistor and a capacitor to filter out high-frequency noise.
  • The recommended power-up sequence is to apply VCC first, followed by VEE, and then the input signals. This ensures proper device operation and prevents latch-up.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device near its maximum junction temperature (150°C).
  • To minimize EMI, use a compact layout, keep signal traces short, and avoid crossing signal lines over the device. Also, use a ground plane and decoupling capacitors to reduce noise.

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TMUX1119DBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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