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TMUX1237DCKR - Texas Instruments

Description: Analog Switch ICs 3- low ron, 5-V, 2:1 (SPDT) general purpose switch with no overshoot when switching inputs 6-SC70 -40 to 125

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PCB Footprints
TMUX1237DCKR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
TMUX1237DCKR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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TMUX1237DCKR Details

  • Manufacturer Part Number:

    TMUX1237DCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-03-29

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    250 MHz

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    44 dB

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    6 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.05 A

  • Supply Current-Max (Isup):

    0.0008 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.08 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    300 ns

  • Switch-on Time-Max:

    300 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

TMUX1237DCKR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TMUX1237DCKR involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog signal traces. Additionally, it's recommended to place the device close to the analog signal sources and use a low-ESR capacitor for power decoupling.
  • To ensure proper power and decoupling, use a low-ESR capacitor (e.g., 10uF) between the VCC and GND pins, and a 0.1uF capacitor between the VCC and AVCC pins. Also, ensure the power supply is clean and regulated, and the device is operated within the recommended voltage range (1.65V to 3.6V).
  • The TMUX1237DCKR can multiplex analog signals up to 1 MHz, but the actual frequency limit depends on the specific application, signal amplitude, and PCB layout. For higher frequency signals, consider using a dedicated analog multiplexer or a higher-speed device.
  • To minimize leakage current, ensure the device is operated within the recommended temperature range (–40°C to 85°C), and use a low-leakage current layout on the PCB. Additionally, consider using a guard ring or a leakage current reduction technique, such as a 'leakage current cancellation' circuit.
  • The recommended method for controlling the TMUX1237DCKR's channel selection is by using a 3-wire serial interface (SCL, SDA, and ADR) or a 2-wire serial interface (SCL and SDA). Use a microcontroller or a dedicated IC to generate the control signals, and ensure the signals are properly buffered and terminated.

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TMUX1237DCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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