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TMUX6104PWR - Texas Instruments

Description: ±16.5-V, low-capacitance, low-leakage-current, 4:1 precision analog multiplexer

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TMUX6104PWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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3D Models
TMUX6104PWR - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G14)
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TMUX6104PWR Details

  • Manufacturer Part Number:

    TMUX6104PWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-02-18

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 4:1

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    400 MHz

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • On-state Resistance-Max (Ron):

    250 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.027 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TMUX6104PWR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use controlled impedance traces, minimize trace length, and add termination resistors as needed. Also, ensure that the signal lines are routed away from power and ground planes to minimize noise coupling.
  • The maximum operating frequency is 100 MHz, but it can be limited by the specific application and PCB layout. It's recommended to perform signal integrity simulations to determine the maximum frequency for a specific design.
  • Power sequencing is critical to prevent latch-up and ensure proper device operation. The recommended power-up sequence is VCC, then VDD, and finally the input signals. The power-down sequence should be reversed.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using a heat sink or thermal pad to dissipate heat. Also, avoid overheating during soldering and rework.

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TMUX6104PWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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