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TMUX6121DGSR - Texas Instruments

Description: ±16.5-V, low-capacitance, low-leakage-current, precision, dual SPST switch (normally open)

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TMUX6121DGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP10
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TMUX6121DGSR - Texas Instruments  - 3D model - Small Outline Packages - VSSOP10
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TMUX6121DGSR Details

  • Manufacturer Part Number:

    TMUX6121DGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-12-24

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 1:1 SPST

  • Analog IC - Other Type:

    SPST

  • Bandwidth-Nom:

    630 MHz

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    85 dB

  • On-state Resistance Match-Nom:

    2.4 Ω

  • On-state Resistance-Max (Ron):

    245 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.023 mA

  • Supply Voltage-Max (Vsup):

    33 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    85 ns

  • Switch-on Time-Max:

    121 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TMUX6121DGSR Frequently Asked Questions (FAQs)

  • To minimize signal degradation, it's recommended to follow a star topology for the signal traces, keep the signal traces short and direct, and use a solid ground plane to reduce electromagnetic interference (EMI). Additionally, use a 50-ohm transmission line impedance for the signal traces and avoid 90-degree turns.
  • For proper termination, use a 100-ohm differential termination resistor (RT) between the differential pairs, and a 50-ohm single-ended termination resistor (RT/2) to VCC or GND. Ensure the termination resistors are placed close to the TMUX6121DGSR to minimize signal reflections.
  • The TMUX6121DGSR can operate up to 12 Gbps. However, as the frequency increases, signal integrity may be affected due to increased attenuation, jitter, and crosstalk. To mitigate these effects, use a well-designed PCB layout, ensure proper termination, and consider using signal conditioning or equalization techniques.
  • Power sequencing is critical for the TMUX6121DGSR. Ensure that VCC is applied before the input signals, and the reset pin (RESET) is asserted low during power-up. Hold the reset pin low for at least 10 ms after VCC reaches 90% of its nominal value. Release the reset pin when the device is fully powered up.
  • The TMUX6121DGSR has a maximum junction temperature (TJ) of 150°C. Ensure good thermal conductivity by using a heat sink or thermal pad, and keep the device away from heat sources. Monitor the device temperature and adjust the operating conditions to prevent overheating, which can lead to reduced reliability and lifespan.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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