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TN0104N8-G - Microchip

Description: MOSFET 40V 2Ohm

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PCB Footprints
TN0104N8-G - Microchip PCB footprint - Other - Other - 3-Lead TO-243AA (SOT-89)
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3D Models
TN0104N8-G - Microchip  - 3D model - Other - 3-Lead TO-243AA (SOT-89)
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TN0104N8-G Details

  • Manufacturer Part Number:

    TN0104N8-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, SOT-89, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-89-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD, LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    0.63 A

  • Drain-source On Resistance-Max:

    2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JEDEC-95 Code:

    TO-243AA

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN0104N8-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane to reduce thermal resistance.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider the thermal derating curves and ensure that the device is properly heatsinked.
  • To prevent ESD damage, it is recommended to use a human body model (HBM) ESD protection circuit at the input pins. Additionally, ensure that the PCB design includes ESD protection diodes and resistors to prevent voltage spikes.
  • Yes, the TN0104N8-G is suitable for high-reliability applications. However, it is essential to follow the recommended operating conditions, and ensure that the device is properly qualified and screened according to the application's requirements.
  • To ensure reliable assembly, follow the recommended soldering temperature profile, and use a solder with a melting point above 217°C. Additionally, ensure that the device is handled and stored according to the recommended guidelines to prevent damage.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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