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TN0620N3-G - Microchip

Description: MOSFET 200V 6Ohm

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TN0620N3-G - Microchip PCB footprint - Other - Other - TO-92 (N3)
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TN0620N3-G - Microchip  - 3D model - Other - TO-92 (N3)
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TN0620N3-G Details

  • Manufacturer Part Number:

    TN0620N3-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-92, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    0.25 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    35 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN0620N3-G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pour on the bottom layer for heat dissipation.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and consider using a voltage regulator with a low dropout voltage to maintain a stable supply voltage.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filtering on I/O lines. Follow Microchip's EMI design guidelines and consider using a common-mode choke on the USB interface.
  • Use the device's low-power modes, optimize clock frequencies, and minimize I/O activity. Consider using a low-dropout voltage regulator and a power-gating strategy to reduce power consumption.
  • Use Microchip's MPLAB X IDE, implement a modular firmware architecture, and use debugging tools like the MPLAB ICD 4 or the PICkit 4. Consider using a version control system and a continuous integration pipeline.

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TN0620N3-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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