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TND321VD-TL-E - onsemi

Description: Motor Driver Dual Inverter Driver

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PCB Footprints
TND321VD-TL-E - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-28FL/VEC8 CASE318AH ISSUE O
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TND321VD-TL-E - onsemi  - 3D model - SO Transistor Flat Lead - SOT-28FL/VEC8 CASE318AH ISSUE O
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TND321VD-TL-E Details

  • Manufacturer Part Number:

    TND321VD-TL-E

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOF-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    318AH

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSOF

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Seated Height-Max:

    0.75 mm

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.06 µs

  • Turn-on Time:

    0.045 µs

  • Width:

    2.3 mm

TND321VD-TL-E Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure proper biasing, follow the recommended operating conditions in the datasheet. Typically, this involves applying a voltage supply within the recommended range (e.g., 12V to 15V) and ensuring the input and output capacitors are properly sized and placed. Additionally, ensure the device is operated within the recommended temperature range.
  • To prevent overheating, monitor the device's junction temperature (Tj), which can be estimated using the thermal resistance (RθJA) and the power dissipation (PD). Also, monitor the input voltage, output current, and ambient temperature to ensure they are within the recommended operating conditions.
  • When selecting input and output capacitors, consider the device's recommended operating conditions, the desired ripple voltage, and the maximum allowed ESR (Equivalent Series Resistance). Typically, X7R or X5R ceramic capacitors with a voltage rating of 25V or higher are suitable for input and output capacitors.
  • Follow the recommended soldering and rework conditions in the datasheet or onsemi's application notes. Typically, this involves using a soldering iron with a temperature of 260°C to 280°C, and a soldering time of 3 to 5 seconds. For rework, use a hot air rework station with a temperature of 220°C to 250°C and a airflow rate of 10 to 20 L/min.

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TND321VD-TL-E Overview

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