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TND524VS-TL-H - onsemi

Description: MOSFET Power Driver

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TND524VS-TL-H - onsemi - PCB symbol
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PCB Footprints
TND524VS-TL-H - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-28FL/VEC8 CASE318AH ISSUE O
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TND524VS-TL-H - onsemi - 3D model - SO Transistor Flat Lead - SOT-28FL/VEC8 CASE318AH ISSUE O
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TND524VS-TL-H Details

  • Manufacturer Part Number:

    TND524VS-TL-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    318AH

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSOF

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.75 mm

  • Supply Voltage-Max:

    30 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    20 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.115 µs

  • Turn-on Time:

    0.12 µs

  • Width:

    2.3 mm

TND524VS-TL-H Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and placing thermal vias under the device to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure good airflow around the device. Additionally, the device should be operated within its specified temperature range and derated accordingly.
  • The TND524VS-TL-H has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2 kV and a machine model (MM) of 200 V are recommended.
  • Yes, the TND524VS-TL-H is AEC-Q101 qualified, making it suitable for use in automotive applications. However, it is essential to ensure that the device is operated within its specified temperature range and that the application meets the required automotive standards.
  • The recommended storage condition for the TND524VS-TL-H is in a dry, cool place with a temperature range of -40°C to 125°C and humidity below 60%. The device should be stored in its original packaging or in a similar anti-static package.

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TND524VS-TL-H Overview

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