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TNPV12061M00BXEN - Vishay

Description: Res Thin Film 1206 1M Ohm 0.1% 0.25W(1/4W) ±15ppm/°C Sulfur Resistant Pad SMD Automotive T/R

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Symbol
TNPV12061M00BXEN - Vishay - PCB symbol
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PCB Footprints
TNPV12061M00BXEN - Vishay PCB footprint - Other - Other - TNPV12061M80BEEN-1
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TNPV12061M00BXEN - Vishay - 3D model - Other - TNPV12061M80BEEN-1
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TNPV12061M00BXEN Details

  • Manufacturer Part Number:

    TNPV12061M00BXEN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    14

  • Additional Feature:

    ANTI-SULFUR; LASER TRIMMABLE; PRECISION; RATED AC VOLTAGE (V): 700

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    15 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    700 V

TNPV12061M00BXEN Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TNPV12061M00BXEN is a 1206 package with a pad size of 1.7mm x 1.7mm and a spacing of 0.5mm between pads.
  • To ensure reliability in high-temperature applications, ensure that the component is operated within its specified temperature range (-55°C to 150°C), and follow proper derating guidelines for voltage and current.
  • The maximum allowable voltage derating for the TNPV12061M00BXEN is 80% of the rated voltage at 125°C, and 90% of the rated voltage at 85°C.
  • To ensure optimal solderability, handle the TNPV12061M00BXEN by the edges, avoid touching the pads, and store the components in a dry, ESD-protected environment.
  • The recommended reflow soldering profile for the TNPV12061M00BXEN is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, and a dwell time of 30-60 seconds above 220°C.

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TNPV12061M00BXEN Overview

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Part Image TNPV12061M00BXEA Vishay Intertechnologies

Fixed Resistor, Thin Film, 0.25W, 1000000ohm, 700V, 0.1% +/-Tol, 15ppm/Cel, Surface Mount, 1206, CHIP