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TNY275PG - Power Integrations

Description: AC/DC Converters 11.5 W (85-265 VAC) 15 W (230 VAC)

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PCB Footprints
TNY275PG - Power Integrations PCB footprint - Other - Other - PDIP-8C (P Package)_2022
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3D Models
TNY275PG - Power Integrations  - 3D model - Other - PDIP-8C (P Package)_2022
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TNY275PG Details

  • Manufacturer Part Number:

    TNY275PG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDIP-T7

  • Length:

    9.575 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP7/8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    265 V

  • Supply Voltage-Min (Vsup):

    85 V

  • Supply Voltage-Nom (Vsup):

    230 V

  • Surface Mount:

    NO

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.6V

  • Width:

    7.62 mm

TNY275PG Frequently Asked Questions (FAQs)

  • The TNY275PG is a 25W offline switcher IC, but the maximum output power depends on the specific application and design. However, as a general guideline, it can handle up to 20W of output power with proper thermal management and design considerations.
  • To ensure the TNY275PG operates within its SOA, follow the guidelines in the datasheet for maximum voltage, current, and power dissipation. Additionally, ensure proper thermal management, such as using a heat sink and keeping the junction temperature below 150°C.
  • For optimal performance and reliability, follow the recommended layout and PCB design guidelines in the datasheet and application notes. Key considerations include keeping the high-voltage and low-voltage sections separate, using a solid ground plane, and minimizing loop areas and parasitic inductances.
  • To minimize standby power consumption, ensure that the input voltage is as low as possible, use a high-efficiency transformer, and optimize the circuit design for low quiescent current. Additionally, consider using the TNY275PG's built-in low-power modes and adaptive switching frequency to reduce power consumption during standby.
  • To ensure EMI and EMC compliance, follow the guidelines in the datasheet and application notes for layout, component selection, and shielding. Additionally, consider using EMI filters, common-mode chokes, and shielding to minimize radiated emissions and conducted noise.

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TNY275PG Overview

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