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TNY287DG-TL - Power Integrations

Description: POWER INTEGRATIONS - TNY287DG-TL - AC/DC CONV, FLYBACK, 18W, 150DEG C

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PCB Footprints
TNY287DG-TL - Power Integrations PCB footprint - Other - Other - TNY287DG-TL-3
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3D Models
TNY287DG-TL - Power Integrations  - 3D model - Other - TNY287DG-TL-3
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TNY287DG-TL Details

  • Manufacturer Part Number:

    TNY287DG-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    40

TNY287DG-TL Frequently Asked Questions (FAQs)

  • The maximum output power of the TNY287DG-TL depends on the input voltage, output voltage, and the transformer turns ratio. However, the device is typically capable of delivering up to 25W of output power.
  • To ensure stability, it's essential to follow the recommended layout guidelines, use a suitable transformer, and add sufficient input and output capacitors. Additionally, the device's feedback pin should be properly connected to the output voltage sense point.
  • The bootstrap capacitor (Cb) is used to generate the high-side gate drive voltage for the internal power MOSFET. It's essential to choose a capacitor with a suitable voltage rating and capacitance value to ensure proper operation.
  • When selecting a transformer, consider the input voltage, output voltage, and power rating. The transformer's turns ratio, inductance, and core material should be suitable for the application. Power Integrations provides a transformer design tool to help with the selection process.
  • To ensure reliable operation, it's essential to provide adequate heat sinking, use a thermally conductive PCB material, and keep the device away from heat sources. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently.

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TNY287DG-TL Overview

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