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TNY289KG - Power Integrations

Description: Converter Offline Flyback Topology 124kHz ~ 140kHz 12-ESOP 725V 67% 124kHz ~ 140kHz 25 W -40°C ~ 150°C (TJ)

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PCB Footprints
TNY289KG - Power Integrations PCB footprint - Other - Other - eSOP-12B(K Package)_2026
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3D Models
TNY289KG - Power Integrations  - 3D model - Other - eSOP-12B(K Package)_2026
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TNY289KG Details

  • Manufacturer Part Number:

    TNY289KG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Power Integrations

  • YTEOL:

    0

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    40

TNY289KG Frequently Asked Questions (FAQs)

  • The maximum output power of the TNY289KG depends on the input voltage, output voltage, and current. However, according to the datasheet, the maximum output power is typically around 90W.
  • To ensure safe operation, the TNY289KG should be mounted on a suitable heat sink, and the ambient temperature should be kept below 85°C. Additionally, the device should be operated within the recommended operating conditions specified in the datasheet.
  • The recommended input capacitor value for the TNY289KG is typically in the range of 1uF to 10uF, depending on the input voltage and output power requirements. A larger capacitor value can help to reduce input voltage ripple and improve system stability.
  • To optimize the transformer design for the TNY289KG, follow the guidelines provided in the datasheet and application notes. Key considerations include selecting the correct transformer turns ratio, ensuring adequate magnetizing inductance, and minimizing leakage inductance.
  • For optimal performance and thermal management, ensure that the PCB layout provides adequate clearance and thermal relief around the TNY289KG. Use a multi-layer PCB with a solid ground plane, and consider using thermal vias to improve heat dissipation.

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TNY289KG Overview

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