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TP2104N3-G-P003 - Microchip

Description: P-Channel 40 V 175mA (Tj) 740mW (Ta) Through Hole TO-92-3 , 6Ohm @ 500mA, 10V , 60 pF @ 25 V , -55°C ~ 150°C (TJ)

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TP2104N3-G-P003 - Microchip - PCB symbol
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TP2104N3-G-P003 - Microchip PCB footprint - Other - Other - 3-lead TO-92_2025
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TP2104N3-G-P003 - Microchip - 3D model - Other - 3-lead TO-92_2025
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TP2104N3-G-P003 Details

  • Manufacturer Part Number:

    TP2104N3-G-P003

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    0.175 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.74 W

  • Power Dissipation-Max (Abs):

    0.74 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TP2104N3-G-P003 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB.
  • The internal voltage regulator has a limited current capability (typically 50mA) and may not be suitable for powering external components. It's recommended to use an external voltage regulator for powering external components or high-current applications.
  • To configure the device for low-power operation, use the Power Management (PM) registers to control the clock frequency, voltage regulator, and peripheral power modes. Additionally, consider using the device's sleep and shutdown modes to minimize power consumption.
  • The TP2104N3-G-P003 has built-in ESD protection on all pins, with a human body model (HBM) rating of 2kV and a charged device model (CDM) rating of 1kV. However, it's still recommended to follow proper ESD handling and protection procedures during device handling and PCB assembly.

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TP2104N3-G-P003 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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