TP3404V/63SN footprint, schematic symbol and 3D model by Texas Instruments

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PCB Footprints

TP3404V/63SN - Texas Instruments PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - FN (S-PQCC-J28 )

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Datasheet Download Datasheet
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Part Number TP3404V/63SN
Manufacturer Texas Instruments
Pin Count 28
Part Category Integrated Circuit
Package Category Plastic Leaded Chip Carrier
Footprint Name Plastic Leaded Chip Carrier - FN (S-PQCC-J28 )
Released Date Oct 31, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

TP3404V/63SN Details

Manufacturer Part Number:
TP3404V/63SN
Brand Name:
Texas Instruments
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
LCC-28
HTS Code:
8542.39.00.01
Manufacturer:
Texas Instruments
YTEOL:
0
Data Rate:
144 Mbps
ISDN Access Rate:
BASIC
JESD-30 Code:
S-PQCC-J28
JESD-609 Code:
e3
Length:
11.505 mm
Moisture Sensitivity Level:
2A
Number of Functions:
1
Number of Terminals:
28
Operating Temperature-Max:
70 °C
Output High Voltage-Min:
2.4 V
Output Low Current-Max:
0.001 A
Output Low Voltage-Max:
0.4 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
QCCJ
Package Equivalence Code:
LDCC28,.5SQ
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Reference Point:
U
Seated Height-Max:
4.57 mm
Supply Current-Max:
75 mA
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Telecom IC Type:
TIME SLOT ASSIGNER
Temperature Grade:
COMMERCIAL
Terminal Finish:
MATTE TIN
Terminal Form:
J BEND
Terminal Pitch:
1.27 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
11.505 mm

TP3404V/63SN Frequently Asked Questions (FAQs)

Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power dissipation. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink.
Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
Texas Instruments recommends using a human-body model (HBM) ESD protection circuit with a minimum of 2 kV rating to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
A 10 μF to 22 μF ceramic capacitor with an X5R or X7R dielectric is recommended for input decoupling. The capacitor should be placed as close as possible to the input pins to minimize noise and ensure stable operation.

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TP3404V/63SN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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