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TP5335K1-G - Microchip

Description: MICROCHIP - TP5335K1-G - Power MOSFET, DMOS, P Channel, 350 V, 85 mA, 30 ohm, TO-236AB, Surface Mount

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TP5335K1-G - Microchip - PCB symbol
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PCB Footprints
TP5335K1-G - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
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3D Models
TP5335K1-G - Microchip - 3D model - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for TP5335K1-G
  • Part Number TP5335K1-G
  • Manufacturer Microchip
  • Pin Count 3
  • Part Category MOSFET (P-Channel)
  • Package Category SOT23 (3-Pin)
  • Footprint Name SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
  • Released Date Oct 14, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

TP5335K1-G Details

  • Manufacturer Part Number:

    TP5335K1-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    350 V

  • Drain Current-Max (ID):

    0.085 A

  • Drain-source On Resistance-Max:

    30 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.36 W

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TP5335K1-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a large copper area to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Also, consider using a heat sink or thermal interface material to improve heat dissipation. Finally, follow proper PCB design and layout guidelines to minimize thermal resistance.
  • The recommended input capacitor is a 10uF ceramic capacitor with X7R or X5R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with X7R or X5R dielectric. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the device's output voltage regulation, first check the input voltage and ensure it is within the recommended range. Next, verify that the output capacitor is properly connected and of the recommended value. Finally, check for any signs of overheating or excessive current draw.
  • Operating the device at a lower input voltage may affect its performance and efficiency. The device's output voltage regulation may be compromised, and the device may not be able to deliver its full current capability. Ensure that the input voltage is within the recommended range to ensure optimal performance.

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TP5335K1-G Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like TP533, or try a keyword search, such as Small Signal Field-Effect Transistors

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image TP5335K1-G-VAO Microchip Technology Inc

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -350V, 30 Ohm