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TP5552-VR - 3Peak Incorporated

Description: Precision Operational Amplifier, 2 Circuit, 8-MSOP

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TP5552-VR - 3Peak Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8-1
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TP5552-VR - 3Peak Incorporated  - 3D model - Small Outline Packages - MSOP8-1
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TP5552-VR Details

  • Manufacturer Part Number:

    TP5552-VR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    MSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    3peak Incorporated

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    31622.78

  • Wideband:

    NO

  • Width:

    3 mm

TP5552-VR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TP5552-VR near a thermal pad or a heat sink, ensuring good airflow, and minimizing thermal resistance between the device and the heat sink. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 125°C) and ensure proper heat sinking. Additionally, consider using thermal interface materials, such as thermal tape or thermal grease, to improve heat transfer between the device and the heat sink.
  • The recommended input capacitor is a 10uF ceramic capacitor with an X7R or X5R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with an X7R or X5R dielectric. These capacitors should be placed as close to the device as possible to minimize parasitic inductance.
  • To protect the device from overvoltage and undervoltage conditions, consider using a voltage supervisor or a voltage monitor IC that can detect and respond to voltage faults. Additionally, ensure that the input voltage is within the recommended operating range (4.5V to 18V) and use a suitable input capacitor to filter out voltage transients.
  • The recommended startup sequence for the TP5552-VR involves applying the input voltage (VIN) first, followed by the enable signal (EN). This ensures that the device is properly biased and configured before the output voltage is enabled.

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TP5552-VR Overview

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