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TP89R103NL,LQ - Toshiba

Description: MOSFET N-Ch DTMOS VII-H 1.9W 630pF 15A 30V

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TP89R103NL,LQ - Toshiba - PCB symbol
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PCB Footprints
TP89R103NL,LQ - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 2-5R1S_1
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3D Models
TP89R103NL,LQ - Toshiba - 3D model - Small Outline Packages - 2-5R1S_1
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TP89R103NL,LQ Details

  • Manufacturer Part Number:

    TP89R103NL,LQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    28 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.0091 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    52 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    76 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TP89R103NL,LQ Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the top and bottom layers to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
  • Toshiba recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. It is also recommended to use a solder with a melting point of 217°C or higher.
  • Yes, the TP89R103NL,LQ is designed to withstand vibrations up to 10G. However, it is recommended to follow proper mounting and soldering techniques to ensure reliable operation in high-vibration environments.
  • Toshiba recommends storing the TP89R103NL,LQ in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the component in direct sunlight or near heat sources.

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TP89R103NL,LQ Overview

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