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TPA2008D2PWP - Texas Instruments

Description: 3-W Stereo Class-D Audio Amplifier with Volume Control (TPA2008)

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PCB Footprints
TPA2008D2PWP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0024B _2021
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3D Models
TPA2008D2PWP - Texas Instruments  - 3D model - Small Outline Packages - PWP0024B _2021
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TPA2008D2PWP Details

  • Manufacturer Part Number:

    TPA2008D2PWP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    24

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    VOLUME CONTROL CIRCUIT

  • Harmonic Distortion:

    5%

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Noise Figure-Nom:

    96 dB

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPA2008D2PWP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout for the TPA2008D2PWP in the application note SLVAU72, which includes guidelines for thermal pad connection, copper pour, and via placement to minimize thermal resistance and ensure reliable operation.
  • The gain setting for the TPA2008D2PWP depends on the specific application requirements. TI provides a gain selection table in the datasheet, which takes into account the input voltage, output power, and desired gain. Additionally, the TPA2008D2PWP evaluation module (TPA2008D2PWP-EVM) can be used to experiment with different gain settings and evaluate their impact on system performance.
  • The TPA2008D2PWP is rated for a maximum power dissipation of 2.5 W. However, the actual power handling capability depends on the operating conditions, such as supply voltage, output power, and ambient temperature. TI provides a power dissipation calculator in the datasheet to help estimate the maximum power handling capability for a given application.
  • To ensure EMC with the TPA2008D2PWP, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, TI provides EMC guidelines and recommendations in the application note SLVAU73.
  • The recommended input and output coupling capacitor value for the TPA2008D2PWP depends on the specific application requirements and operating frequency. As a general guideline, TI recommends using a 1-10 μF capacitor for input coupling and a 10-100 nF capacitor for output coupling. However, the optimal capacitor value may need to be experimentally determined for a given application.

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TPA2008D2PWP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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