FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Current-Max:
28.5 mA
Supply Voltage-Max (Vsup):
14 V
Supply Voltage-Min (Vsup):
8.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
7 mm
TPA3002D2PHPR Frequently Asked Questions (FAQs)
Texas Instruments recommends using a 10uF capacitor in parallel with a 100nF capacitor, both connected between the power supply pins (VCC and GND) to ensure stable operation.
To minimize electromagnetic interference (EMI) and ensure optimal performance, keep the power supply traces short and wide, use a solid ground plane, and place the amplifier close to the speaker. Additionally, use a common ground point for the amplifier and the speaker.
The maximum power dissipation of the TPA3002D2PHPR is 15W. However, this value can be affected by the ambient temperature, PCB design, and other factors. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
Yes, the TPA3002D2PHPR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply, PCB layout, and thermal management to ensure reliable operation.
To protect the amplifier from overvoltage and undervoltage conditions, use a voltage regulator or a voltage supervisor to ensure the power supply voltage remains within the recommended operating range (8V to 26V). Additionally, consider using overvoltage protection (OVP) and undervoltage protection (UVP) circuits.
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TPA3002D2PHPR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
