Please enter a minimum 3 letters or numbers
Technical Content
Part Image

TPC8125,LQ(S - Toshiba

Description: TPC8125,LQ(S P-Channel MOSFET, 10 A, 30 V, 8-Pin SOP Toshiba

Download TPC8125,LQ(S Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
TPC8125,LQ(S - Toshiba - PCB symbol
click to zoom
PCB Footprints
TPC8125,LQ(S - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - TPC8125,LQ(S
click to zoom
3D Models
TPC8125,LQ(S - Toshiba - 3D model - Small Outline Packages - TPC8125,LQ(S
click to zoom

TPC8125,LQ(S Details

  • Manufacturer Part Number:

    TPC8125,LQ(S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, THIN, 2-5R1A, 8 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPC8125,LQ(S Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a bypass capacitor (CBYP) to ensure proper biasing. A 10uF ceramic capacitor is recommended for CBYP. Additionally, the input voltage should be filtered to prevent noise and ripple.
  • The maximum allowed power dissipation for the TPC8125 is 2.5W. Exceeding this limit may cause the device to overheat and reduce its lifespan.
  • An overvoltage protection (OVP) circuit and an undervoltage lockout (UVLO) circuit can be implemented to protect the device from voltage transients and faults. A zener diode or a voltage regulator can be used for OVP, and a voltage supervisor IC can be used for UVLO.
  • The TPC8125 is designed to operate at frequencies up to 1MHz. Operating the device at frequencies above 1MHz may cause instability and reduce its performance.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TPC8125,LQ(S Overview

Use the download button to access the TPC8125,LQ(S schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TPC81, or try a keyword search, such as Small Signal Field-Effect Transistors

Parts related to TPC8125,LQ(S

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑