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TPCC8093,L1Q - Toshiba

Description: MOSFET N-Ch 20V FET 21A 30W 1860pF 16nC

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TPCC8093,L1Q - Toshiba PCB footprint - Other - Other - TPW1R005PL,L1Q-4
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TPCC8093,L1Q Details

  • Manufacturer Part Number:

    TPCC8093,L1Q

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSON-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0.4

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.0095 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    140 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    30 W

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPCC8093,L1Q Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Yes, the TPCC8093, L1Q is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment. The device also has built-in ESD protection, but additional external protection may be necessary depending on the application.

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TPCC8093,L1Q Overview

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