TPD1038F(TE12L,Q) footprint, schematic symbol and 3D model by Toshiba

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Part Number TPD1038F(TE12L,Q)
Manufacturer Toshiba
Pin Count 8
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - SOP 8
Released Date Apr 13, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

TPD1038F(TE12L,Q) Details

Manufacturer Part Number:
TPD1038F(TE12L,Q)
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
SOP-8
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
Toshiba America Electronic Components
YTEOL:
0
Built-in Protections:
OVER CURRENT; OVER VOLTAGE; THERMAL
Driver Number of Bits:
1
Input Characteristics:
STANDARD
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G8
Length:
5 mm
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
110 °C
Operating Temperature-Min:
-40 °C
Output Characteristics:
OPEN-DRAIN
Output Current Flow Direction:
SINK
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Packing Method:
TR, EMBOSSED
Qualification Status:
Not Qualified
Seated Height-Max:
1.7 mm
Supply Current-Max:
3 mA
Supply Voltage-Max:
18 V
Supply Voltage-Min:
6 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
INDUSTRIAL
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Turn-off Time:
40 µs
Turn-on Time:
100 µs
Width:
4.4 mm

TPD1038F(TE12L,Q) Frequently Asked Questions (FAQs)

Toshiba recommends a 4-layer PCB with a solid ground plane and a separate power plane for the TPD1038F. The device should be placed near the connector to minimize signal loss and noise. A minimum of 10mil clearance between the device and other components is recommended.
Toshiba recommends using a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. The device should be aligned with the PCB pads and a solder paste with a melting point of 217°C should be used. Avoid applying excessive force or pressure during the soldering process.
The TPD1038F is rated for operation from -40°C to 125°C. However, the device's performance may degrade at temperatures above 85°C, and it is recommended to derate the device's power handling capability at high temperatures.
Yes, the TPD1038F is designed to withstand vibrations up to 10G (10Hz-2kHz). However, it is recommended to ensure the device is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels.
Toshiba recommends checking the device's pinout and connections, ensuring proper power supply and signal integrity, and verifying that the device is operated within its recommended specifications. If issues persist, contact Toshiba's technical support for further assistance.

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