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TPH11006NL,LQ - Toshiba

Description: MOSFET U-MOSVIII-H 60V 40A 23nC MOSFET

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TPH11006NL,LQ - Toshiba - PCB symbol
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PCB Footprints
TPH11006NL,LQ - Toshiba PCB footprint - Other - Other - TPH11006NL,LQ-2
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TPH11006NL,LQ - Toshiba - 3D model - Other - TPH11006NL,LQ-2
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TPH11006NL,LQ Details

  • Manufacturer Part Number:

    TPH11006NL,LQ

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Avalanche Energy Rating (Eas):

    33 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    34 W

  • Pulsed Drain Current-Max (IDM):

    81 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPH11006NL,LQ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the device's voltage, current, and temperature to ensure they are within the specified limits. Use a thermal management system to prevent overheating, and implement overcurrent protection to prevent damage.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ripple.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use a common-mode choke or ferrite bead to filter the input and output lines. Ensure good PCB layout practices, such as separating analog and digital grounds.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize noise and ripple.

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TPH11006NL,LQ Overview

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