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TPH3R704PL,L1Q - Toshiba

Description: MOSFET 40 Volt N-Channel

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PCB Footprints
TPH3R704PL,L1Q - Toshiba PCB footprint - Other - Other - SOP Advance(WF)_2022
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3D Models
TPH3R704PL,L1Q - Toshiba  - 3D model - Other - SOP Advance(WF)_2022
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TPH3R704PL,L1Q Details

  • Manufacturer Part Number:

    TPH3R704PL,L1Q

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    14 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    92 A

  • Drain-source On Resistance-Max:

    0.0037 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    81 W

  • Pulsed Drain Current-Max (IDM):

    260 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPH3R704PL,L1Q Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • The TPH3R704PL,L1Q has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 10kΩ resistance and 100pF capacitance are recommended for ESD protection.
  • Yes, the TPH3R704PL,L1Q is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • The recommended soldering conditions are 260°C for 10 seconds, with a peak temperature of 240°C. A soldering iron with a temperature range of 200°C to 250°C is recommended.

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TPH3R704PL,L1Q Overview

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