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TPHR6503PL,L1Q - Toshiba

Description: MOSFET 30 Volt N-Channel

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TPHR6503PL,L1Q - Toshiba - PCB symbol
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PCB Footprints
TPHR6503PL,L1Q - Toshiba PCB footprint - Other - Other - SOP ADVANCE
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TPHR6503PL,L1Q - Toshiba - 3D model - Other - SOP ADVANCE
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TPHR6503PL,L1Q Details

  • Manufacturer Part Number:

    TPHR6503PL,L1Q

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    374 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.00089 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    220 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    170 W

  • Pulsed Drain Current-Max (IDM):

    500 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPHR6503PL,L1Q Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (up to 125°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer. Also, ensure that the device is not exposed to excessive moisture or humidity.
  • The recommended soldering conditions are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point of 217°C to 221°C.
  • Store the device in its original packaging or an electrostatic discharge (ESD) protective bag. Avoid exposing the device to excessive moisture, humidity, or physical stress. Handle the device by the body, not the leads, to prevent damage.
  • Use a low-impedance PCB layout to minimize voltage drops and ensure reliable operation. Connect the input and output capacitors as close to the device as possible, and use a low-ESR capacitor for the output filter.

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TPHR6503PL,L1Q Overview

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