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TPS23770PWP - Texas Instruments

Description: TEXAS INSTRUMENTS - TPS23770PWP - POE, IEEE 802.3-2005, 14V, 20HTSSOP

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TPS23770PWP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP(R-PDSO-G20)-ren1
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TPS23770PWP Details

  • Manufacturer Part Number:

    TPS23770PWP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    67 V

  • Input Voltage-Nom:

    48 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.85 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    565 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TPS23770PWP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPS23770PWP evaluation module documentation, which includes guidelines for component placement, trace routing, and thermal management. Following this layout can help minimize noise, reduce EMI, and improve overall performance.
  • The input capacitor should be selected based on the input voltage ripple, output current, and operating frequency. A general guideline is to choose a capacitor with a capacitance value of at least 10uF and a voltage rating of 1.5 to 2 times the input voltage. Additionally, the capacitor's ESR (Equivalent Series Resistance) should be low to minimize voltage ripple.
  • The TPS23770PWP is capable of delivering up to 3.5A of output current, but this is dependent on the input voltage, output voltage, and thermal conditions. It's essential to check the device's thermal performance and power dissipation to ensure reliable operation.
  • The TPS23770PWP has a built-in overcurrent protection feature that can be enabled by connecting the OCP pin to a resistor divider network. The resistor values should be chosen to set the desired overcurrent threshold. Additionally, the device also has a thermal shutdown feature that will turn off the device if the junction temperature exceeds 150°C.
  • The TPS23770PWP is rated for operation up to 125°C, but it's essential to consider the device's power dissipation and thermal performance in high-temperature environments. The device's junction temperature should be kept below 150°C to ensure reliable operation. It's recommended to use thermal management techniques such as heat sinks or thermal interfaces to keep the device within its operating temperature range.

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TPS23770PWP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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