UNDER VOLTAGE; OVER CURRENT; SHORT CIRCUIT; THERMAL; TRANSIENT
Driver Number of Bits:
1
High Side Driver:
YES
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G14
JESD-609 Code:
e4
Length:
5 mm
Moisture Sensitivity Level:
3
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
14
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Characteristics:
OPEN-DRAIN
Output Current Flow Direction:
SOURCE
Output Current-Max:
4 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
HTSSOP
Package Equivalence Code:
TSSOP14,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.2 mm
Supply Current-Max:
10 mA
Supply Voltage-Max:
40 V
Supply Voltage-Min:
4 V
Supply Voltage-Nom:
24 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
80 µs
Turn-on Time:
50 µs
Width:
4.4 mm
TPS27S100APWPR Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink. Additionally, using a 2-3 layer PCB with a thermal via can help to dissipate heat more efficiently.
To ensure proper power-up and configuration, follow the recommended power-up sequence, ensure the input voltage is within the specified range, and configure the device according to the datasheet recommendations. Additionally, use a capacitor on the input pin to filter out noise and ensure a stable input voltage.
To ensure EMI and EMC compliance, use a shielded enclosure, keep the device away from noise sources, use a common-mode choke on the input, and ensure the PCB layout is optimized for EMI reduction. Additionally, follow the recommended layout and component placement guidelines in the datasheet.
To troubleshoot issues, start by checking the input voltage and current, ensuring they are within the specified range. Check for overheating by monitoring the device temperature and ensuring proper airflow. Use an oscilloscope to check for noise and oscillations on the input and output. Consult the datasheet and application notes for troubleshooting guides and FAQs.
Operating the device outside of the recommended operating conditions can lead to reduced performance, decreased reliability, and potentially even device failure. Ensure the device is operated within the specified temperature range, input voltage, and output current to ensure optimal performance and reliability.
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TPS27S100APWPR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
