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TPS2HB16FQPWPRQ1 - Texas Instruments

Description: Power Switch ICs - Power Distribution 40-V, 16-m , 2-ch automotive smart high-side switch with adjustable current limit 16-HTSSOP -40 to 125

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TPS2HB16FQPWPRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0016M,2021
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TPS2HB16FQPWPRQ1 - Texas Instruments  - 3D model - Small Outline Packages - PWP0016M,2021
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TPS2HB16FQPWPRQ1 Details

  • Manufacturer Part Number:

    TPS2HB16FQPWPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSSOP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    7 A

  • Output Peak Current Limit-Nom:

    60 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    147 µs

  • Turn-on Time:

    145 µs

  • Width:

    4.4 mm

TPS2HB16FQPWPRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its recommended operating temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within its recommended temperature range to prevent thermal-related issues.
  • To handle ESD protection for the TPS2HB16FQPWPRQ1, follow proper ESD handling procedures during device handling and assembly, and consider using ESD protection devices or circuits in the system design. Additionally, ensure that the device is properly grounded and that there are no unintended electrical paths that could compromise ESD protection.
  • When assembling and reworking the PCB, ensure that the device is handled and stored in an ESD-safe environment, and that the PCB is properly cleaned and dried before assembly. Follow proper rework procedures to avoid damaging the device or the PCB.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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