SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Surface Mount:
YES
Switcher Configuration:
DOUBLER INVERTER
Switching Frequency-Max:
450 kHz
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
TPS60122PWP Frequently Asked Questions (FAQs)
The recommended layout and placement for the TPS60122PWP involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the loop area of the input and output traces to reduce EMI. TI provides a layout guide in the datasheet and application notes.
To optimize the performance of the TPS60122PWP, consider the specific requirements of your application, such as input voltage range, output voltage, and load current. Adjust the component values and layout accordingly, and use simulation tools like TI's WEBENCH or SPICE models to validate your design.
The TPS60122PWP has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if high power dissipation is expected.
To ensure stability, follow the recommended component values and layout guidelines, and use a sufficient output capacitor with a low ESR. Additionally, consider adding a small ceramic capacitor in parallel with the output capacitor to improve stability.
To minimize EMI, use a shielded inductor, keep the input and output traces short and away from sensitive circuits, and use a common-mode choke if necessary. Additionally, consider using a spread-spectrum clock or frequency hopping to reduce EMI.
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TPS60122PWP Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
