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TPS61301YFFR - Texas Instruments

Description: LED Lighting Drivers 1.5A/4.1A Mult LED Camera Flash Driver

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PCB Footprints
TPS61301YFFR - Texas Instruments PCB footprint - BGA - BGA - YFF (R-XBGA-N20)
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3D Models
TPS61301YFFR - Texas Instruments  - 3D model - BGA - YFF (R-XBGA-N20)
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TPS61301YFFR Details

  • Manufacturer Part Number:

    TPS61301YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    DSBGA-20

  • Pin Count:

    20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-XBGA-B20

  • JESD-609 Code:

    e1

  • Length:

    2.17 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.6 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.5 V

  • Supply Voltage1-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.928 mm

  • fmax-Min:

    3.4 MHz

TPS61301YFFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPS61301YFFR datasheet, but it's also important to follow general high-frequency layout guidelines, such as keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths.
  • The selection of input and output capacitors depends on the specific application requirements, such as the input voltage range, output voltage, and desired ripple and noise performance. TI provides guidelines for capacitor selection in the datasheet, but it's also important to consider factors such as capacitor ESR, ESL, and temperature coefficient.
  • The TPS61301YFFR is rated for operation from -40°C to 125°C, but the maximum ambient temperature range may be limited by the specific application and the thermal design of the system. It's important to consider the thermal performance of the device and the system as a whole to ensure reliable operation.
  • To ensure stability, it's important to follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, it's important to consider the output capacitor ESR and the input voltage range to ensure that the device operates within its stable region. TI also provides a stability analysis tool to help designers evaluate the stability of their design.
  • The typical efficiency of the TPS61301YFFR depends on the specific application and operating conditions, but it can range from 85% to 95% depending on the input voltage, output voltage, and load current. TI provides efficiency curves in the datasheet to help designers estimate the efficiency of their design.

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TPS61301YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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