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TPS61310YFFR - Texas Instruments

Description: 1.5A Multiple LED Camera Flash and Video Light Driver With I2CTM Compatible Interface

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TPS61310YFFR - Texas Instruments PCB footprint - Other - Other - BGA20C40P4X5_217X192X63
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TPS61310YFFR Details

  • Manufacturer Part Number:

    TPS61310YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    DSBGA-20

  • Pin Count:

    20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-XBGA-B20

  • JESD-609 Code:

    e1

  • Length:

    2.17 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.6 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.5 V

  • Supply Voltage1-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.928 mm

  • fmax-Min:

    1.7 MHz

TPS61310YFFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPS61310YFFR datasheet, but it's also important to follow general high-frequency layout guidelines, such as keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths.
  • The choice of input and output capacitors depends on the specific application requirements, such as ripple current, voltage rating, and ESR. A good starting point is to use low-ESR ceramic capacitors with a voltage rating of at least 1.5 times the input voltage. The datasheet provides some guidance on capacitor selection, but it's also recommended to consult the capacitor manufacturer's datasheet and application notes.
  • The TPS61310YFFR is rated for operation up to 85°C ambient temperature, but it's important to consider the thermal derating of the device and the PCB layout to ensure reliable operation. It's recommended to keep the junction temperature below 125°C to ensure long-term reliability.
  • To ensure stability and prevent oscillations, it's important to follow the recommended PCB layout, choose the right input and output capacitors, and ensure that the output voltage is properly decoupled. Additionally, it's recommended to add a small ceramic capacitor (e.g. 10nF) between the VIN and EN pins to filter out noise and prevent oscillations.
  • The TPS61310YFFR is specified to operate from 2.7V to 5.5V input voltage, but optimal performance is typically achieved between 3.3V and 4.2V input voltage. Operating outside of this range may affect efficiency, output voltage accuracy, and stability.

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TPS61310YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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