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TPS79801QDGNRQ1 - Texas Instruments

Description: 50 mA, 3 V TO 50 V, MICROPOWER, LOW-DROPOUT LINEAR REGULATOR

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TPS79801QDGNRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)
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TPS79801QDGNRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)
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TPS79801QDGNRQ1 Details

  • Manufacturer Part Number:

    TPS79801QDGNRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    HVSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage-Max:

    50 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.014

  • Load Regulation-Max(%):

    2.5%

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.05 A

  • Output Voltage1-Max:

    28 V

  • Output Voltage1-Min:

    1.275 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    3 mm

TPS79801QDGNRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS79801QDGNRQ1 involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure stability, follow the recommended component values and PCB layout, and make sure the output capacitor is properly sized and placed. Additionally, ensure the input voltage is within the recommended range and the device is not subjected to excessive noise or EMI.
  • The TPS79801QDGNRQ1 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. Consult the datasheet and thermal design guidelines for more information.
  • Yes, the TPS79801QDGNRQ1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using automotive-grade processes.
  • Power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. Consult the datasheet for more information on power dissipation and thermal design guidelines.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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