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TPS82671SIPT - Texas Instruments

Description: 600mA Fully Integrated, Low Noise Step-Down Converter Module in MicroSiP™ Package

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TPS82671SIPT - Texas Instruments - PCB symbol
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PCB Footprints
TPS82671SIPT - Texas Instruments PCB footprint - BGA - BGA - SIP (R-uSIP-N8)
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3D Models
TPS82671SIPT - Texas Instruments - 3D model - BGA - SIP (R-uSIP-N8)
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TPS82671SIPT Details

  • Manufacturer Part Number:

    TPS82671SIPT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO HAS CONTROL TECHNIQUE OF PFM

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    4.8 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    1.8 V

  • Output Voltage-Min:

    1.8 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA8,3X3,40/32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    6000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.3 mm

TPS82671SIPT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS82671SIPT involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output voltage can be stabilized by adding a 10nF to 22nF ceramic capacitor in parallel with the output capacitor, and by using a low-ESR output capacitor.
  • The TPS82671SIPT can handle input voltages up to 17V, but it's recommended to operate within the specified input voltage range of 2.7V to 15V for optimal performance and reliability.
  • The TPS82671SIPT is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and thermal management guidelines to ensure reliable operation.
  • To troubleshoot issues, start by verifying the PCB layout and component values against the recommended design. Check for any signs of overheating, such as excessive temperature rise or thermal shutdown. Use an oscilloscope to monitor the input and output voltages, and ensure that the device is operating within the recommended specifications.

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TPS82671SIPT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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