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TPS826745SIPR - Texas Instruments

Description: 600mA Fully Integrated, Low Noise Step-Down Converter in MicroSiP(TM) Package

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TPS826745SIPR - Texas Instruments PCB footprint - BGA - BGA - SIP-8
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TPS826745SIPR - Texas Instruments  - 3D model - BGA - SIP-8
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TPS826745SIPR Details

  • Manufacturer Part Number:

    TPS826745SIPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    4.8 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    1.225 V

  • Output Voltage-Min:

    1.225 V

  • Output Voltage-Nom:

    1.225 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA8,3X3,40/32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    6000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.3 mm

TPS826745SIPR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TPS826745SIPR datasheet (section 10.2) and in the TPS82674EVM-001 evaluation module documentation. It's essential to follow these guidelines to minimize noise, ensure proper thermal management, and optimize performance.
  • The output capacitor selection depends on the output voltage, output current, and desired ripple voltage. TI recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a minimum capacitance of 10uF and a voltage rating of at least 1.5 times the output voltage. Refer to the datasheet (section 7.3.1) for more information.
  • The TPS826745SIPR has an absolute maximum input voltage rating of 6.5V. However, the recommended operating input voltage range is 3.5V to 5.5V. Exceeding the absolute maximum rating can damage the device.
  • The TPS826745SIPR has a built-in OCP and SCP feature. To implement it, connect the OCP pin to a resistor divider network that sets the current limit threshold. The SCP feature is enabled by default and will limit the output current to 2.5A. Refer to the datasheet (section 7.3.4) for more information.
  • The TPS826745SIPR has a thermal derating of 13.3mW/°C above 25°C. This means that the device's power dissipation capability decreases as the ambient temperature increases. Ensure that your design takes into account the thermal derating to prevent overheating and maintain reliable operation.

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TPS826745SIPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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