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TPS826765SIPT - Texas Instruments

Description: Non-Isolated DC/DC Converters 600mA Fully Int Lo Noise SD Cnvrtr

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PCB Footprints
TPS826765SIPT - Texas Instruments PCB footprint - BGA - BGA - SIP-8 (R-uSIP-N8)
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3D Models
TPS826765SIPT - Texas Instruments  - 3D model - BGA - SIP-8 (R-uSIP-N8)
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TPS826765SIPT Details

  • Manufacturer Part Number:

    TPS826765SIPT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    4.8 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    1.05 V

  • Output Voltage-Min:

    1.05 V

  • Output Voltage-Nom:

    1.05 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA8,3X3,40/32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    6000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.3 mm

TPS826765SIPT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and keeping the input and output capacitors close to the device. Additionally, using a 4-layer PCB with a dedicated power plane can help reduce noise and improve performance.
  • The selection of input and output capacitors depends on the specific application requirements. Generally, X5R or X7R ceramic capacitors with a voltage rating of 10V or higher are recommended. The input capacitor should have a low ESR (Equivalent Series Resistance) and be placed close to the VIN pin. The output capacitor should have a low ESR and be placed close to the VOUT pin. A 10uF to 22uF capacitor is a good starting point for most applications.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device. Applying a voltage higher than 5V may cause the device to malfunction or fail.
  • To ensure stability, follow the recommended PCB layout, use a sufficient output capacitor, and keep the input and output capacitors close to the device. Additionally, make sure the input voltage is within the recommended range, and the output current is within the specified limits. If oscillations occur, try adding a small ceramic capacitor (e.g., 100nF) between the VIN and GND pins.
  • The thermal derating of the TPS826765SIPT is specified in the datasheet. As the junction temperature increases, the device's ability to deliver current decreases. To ensure reliable operation, it's essential to consider the thermal derating when selecting the output current. A good rule of thumb is to derate the output current by 1mA per degree Celsius above 25°C.

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TPS826765SIPT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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