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TPS82740BSIPT - Texas Instruments

Description: 200-mA Step Down Converter MicroSiP Module with 360nA quiescent current

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TPS82740BSIPT - Texas Instruments - PCB symbol
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PCB Footprints
TPS82740BSIPT - Texas Instruments PCB footprint - Other - Other - SIP0009F
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3D Models
TPS82740BSIPT - Texas Instruments - 3D model - Other - SIP0009F
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TPS82740BSIPT Details

  • Manufacturer Part Number:

    TPS82740BSIPT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE, ALSO OPERATES IN ADJUSTABLE MODE FROM 1.8 TO 2.5V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.2 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B9

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.2 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    2.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1200 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.3 mm

TPS82740BSIPT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPS82740BSIPT involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. TI provides a recommended PCB layout in the datasheet and application notes.
  • The choice of input and output capacitors depends on the specific application requirements. TI recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The capacitor selection guide in the datasheet can help with the selection process.
  • The TPS82740BSIPT is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's essential to consider the thermal design and heat dissipation in the system to ensure reliable operation.
  • Yes, the TPS82740BSIPT is designed to operate in high-vibration environments. However, it's essential to ensure that the PCB is properly secured and the device is properly soldered to withstand the vibrations. TI provides guidance on vibration testing and PCB design in the datasheet and application notes.
  • TI provides a troubleshooting guide in the datasheet and application notes. Common issues can be resolved by checking the input voltage, output load, and PCB layout. In some cases, it may be necessary to use an oscilloscope to analyze the output voltage and current waveforms.

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TPS82740BSIPT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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