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TPS92661QPHPRQ1 - Texas Instruments

Description: High-Brightness LED Matrix Manager for Automotive Headlight Systems

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TPS92661QPHPRQ1 - Texas Instruments - PCB symbol
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TPS92661QPHPRQ1 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PHP (S-PQFP-G48)_4
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TPS92661QPHPRQ1 - Texas Instruments - 3D model - Quad Flat Packages - PHP (S-PQFP-G48)_4
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TPS92661QPHPRQ1 Details

  • Manufacturer Part Number:

    TPS92661QPHPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Display Mode:

    DOT MATRIX

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Segments:

    12

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • fmax-Min:

    16 MHz

TPS92661QPHPRQ1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a thermal management strategy, such as using a heat sink, thermal interface material, and ensuring good airflow. Monitor the device's temperature using the thermal monitoring pin (TMP) and adjust the system design accordingly.
  • A low-ESR ceramic capacitor (X5R or X7R) with a value of 4.7 μF to 10 μF is recommended to filter the input voltage and reduce noise.
  • Choose a low-ESR ceramic capacitor (X5R or X7R) with a value of 10 μF to 22 μF. Ensure the capacitor's voltage rating is higher than the output voltage, and consider the capacitor's equivalent series resistance (ESR) and equivalent series inductance (ESL) when selecting the optimal value.
  • Keep the high-current paths (VIN, VOUT, and GND) short and wide to minimize resistance and inductance. Use a star-connection for the input and output capacitors to reduce noise and improve stability.

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TPS92661QPHPRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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