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TPSM265R1V3SILR - Texas Instruments

Description: Switching Voltage Regulators 3-V to 65-V input, 100-mA, step-down power module in 2.8 x 3.7 mm package 10-uSiP -40 to 125

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PCB Footprints
TPSM265R1V3SILR - Texas Instruments PCB footprint - Other - Other - SIL0010C_2021
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TPSM265R1V3SILR - Texas Instruments  - 3D model - Other - SIL0010C_2021
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TPSM265R1V3SILR Details

  • Manufacturer Part Number:

    TPSM265R1V3SILR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-02-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE FREQUENCY MODULATION

  • Input Voltage-Max:

    65 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XDMA-N11

  • Length:

    3.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Output Voltage-Max:

    15 V

  • Output Voltage-Min:

    1.223 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.91 mm

  • Supply Current-Max (Isup):

    0.015 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.8 mm

TPSM265R1V3SILR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPSM265R1V3SILR should include a solid ground plane, a small thermal pad, and a minimal number of thermal vias to reduce thermal resistance. A 2-layer or 4-layer PCB is recommended, with the power plane on the top layer and the ground plane on the bottom layer.
  • To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Also, ensure the device is operated within the recommended temperature range of -40°C to 125°C. Additionally, follow the recommended layout and thermal design guidelines to minimize thermal resistance.
  • Exceeding the maximum ratings of the TPSM265R1V3SILR can lead to reduced device reliability, permanent damage, or even device failure. It can also cause the device to overheat, leading to a thermal shutdown or latch-up. Always ensure the device operates within the recommended operating conditions to prevent damage or failure.
  • To troubleshoot issues with the TPSM265R1V3SILR, start by verifying the input voltage, output voltage, and output current. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for any unusual voltage or current waveforms. Consult the datasheet and application notes for troubleshooting guidelines and common failure modes.
  • Not following the recommended layout and thermal design guidelines can lead to reduced device performance, increased thermal resistance, and decreased reliability. It can also cause the device to overheat, leading to thermal shutdown or latch-up. This can result in reduced device lifespan, increased power consumption, and decreased system reliability.

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TPSM265R1V3SILR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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