Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal impedance. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Also, ensure the device is operated within the recommended temperature range (-40°C to 150°C) and the junction temperature (TJ) does not exceed 150°C.
Texas Instruments recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10 μF to 22 μF, depending on the input voltage and output current requirements. The capacitor should be placed as close as possible to the VIN pin.
The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where Iout is the output current, ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. The recommended output capacitance value is 10 μF to 22 μF.
Texas Instruments recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, such as a thermal pad or thermal tape, to improve thermal performance. The TIM should be applied between the device and the heat sink or PCB.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
