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TPSM8A28RDGR - Texas Instruments

Description: Non-Isolated PoL Module DC DC Converter 1 Output 0.6 ~ 5.5V 12A 3V - 16V Input

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Symbol
TPSM8A28RDGR - Texas Instruments - PCB symbol
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PCB Footprints
TPSM8A28RDGR - Texas Instruments PCB footprint - Other - Other - RDG0025A
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3D Models
TPSM8A28RDGR - Texas Instruments - 3D model - Other - RDG0025A
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TPSM8A28RDGR Details

  • Manufacturer Part Number:

    TPSM8A28RDGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3 V

  • JESD-30 Code:

    R-PXMA-N25

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    12 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    4.1 mm

  • Supply Current-Max (Isup):

    0.85 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    HYBRID

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Width:

    6.5 mm

TPSM8A28RDGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TPSM8A28RDGR should include a solid ground plane, a small thermal pad, and a minimal number of thermal vias to reduce thermal resistance. A 2-layer or 4-layer board with a thermal relief pattern is recommended.
  • To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Also, ensure the device is operated within the recommended temperature range of -40°C to 150°C.
  • Handle the device by the body or the pins, avoiding touching the die or any of the internal components. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage.
  • The power dissipation of the TPSM8A28RDGR can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • Thermal design considerations for the TPSM8A28RDGR include providing adequate heat sinking, using a thermal interface material, and ensuring good airflow around the device.

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TPSM8A28RDGR Overview

Use the download button to access the TPSM8A28RDGR schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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