The recommended PCB footprint for the TPSMB15CA-VR is a standard SMC (DO-214AB) package footprint, with a minimum pad size of 2.5mm x 1.5mm and a maximum pad size of 3.5mm x 2.5mm.
Yes, the TPSMB15CA-VR is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
The TPSMB15CA-VR is designed to respond quickly to surge currents, with a typical response time of <1ns. It can handle surge currents up to 15kA (8/20μs) and is suitable for protecting against lightning strikes and other high-energy surges.
Yes, the TPSMB15CA-VR is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
The typical leakage current of the TPSMB15CA-VR is <1μA at room temperature and <5μA at 125°C.
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TPSMB15CA-VR Overview
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