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TPSMP12AHM3_A/H - Vishay

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TPSMP12AHM3_A/H Details

  • Manufacturer Part Number:

    TPSMP12AHM3_A/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMP, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2016-09-21

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.41

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    12.6 V

  • Breakdown Voltage-Min:

    11.4 V

  • Breakdown Voltage-Nom:

    12 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    16.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-220AA

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    185 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    2.5 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    10.2 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    10.2 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

TPSMP12AHM3_A/H Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper pad under the device, connected to a thermal via or a heat sink. This helps to dissipate heat efficiently. Additionally, keeping the PCB layer stack-up symmetrical and using thermal vias can also improve thermal performance.
  • To ensure reliable soldering, follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max, and time above 183°C 180s max. Use a solder with a melting point above 217°C and ensure the PCB is clean and free of oxidation. Avoid using excessive solder or flux, and minimize the number of reflows.
  • The maximum allowed voltage derating for the TPSMP12AHM3_A/H is typically 10-15% below the maximum rated voltage (12V) to ensure reliable operation and prevent premature failure. This means the maximum operating voltage should be around 10.2-10.8V.
  • To prevent ESD damage, handle the TPSMP12AHM3_A/H with ESD-protective equipment, such as wrist straps, mats, or bags. Ensure the workspace is ESD-protected, and avoid touching the device's pins or leads. If you must touch the device, discharge static electricity from your body by touching a grounded object first.
  • Store the TPSMP12AHM3_A/H in a dry, cool place (temperature range: -40°C to 30°C) with relative humidity below 60%. Avoid storing the device in direct sunlight, and keep it away from moisture, chemicals, and contaminants.

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TPSMP12AHM3_A/H Overview

Use the download button to access the TPSMP12AHM3_A/H 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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