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TPSMP22AHM3_A/H - Vishay

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TPSMP22AHM3_A/H Details

  • Manufacturer Part Number:

    TPSMP22AHM3_A/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMP, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2016-09-21

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.39

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    23.1 V

  • Breakdown Voltage-Min:

    20.9 V

  • Breakdown Voltage-Nom:

    22 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    30.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-220AA

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    185 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    2.5 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    18.8 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    18.8 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

TPSMP22AHM3_A/H Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper pad under the device, connected to a thermal via or a heat sink. This helps to dissipate heat efficiently. Additionally, keeping the PCB layer stack-up symmetrical and using thermal vias can also improve thermal performance.
  • To ensure reliable soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 260°C, and avoid applying excessive force or vibration during the soldering process. Also, ensure the PCB is clean and free of oxidation or moisture.
  • The maximum allowed voltage derating for the TPSMP22AHM3_A/H is typically 10-15% below the maximum rated voltage. However, it's recommended to consult with the manufacturer or a qualified engineer to determine the specific derating requirements for your application.
  • While the TPSMP22AHM3_A/H is suitable for high-frequency switching applications, it's essential to consider the device's parasitic capacitance, inductance, and resistance. Ensure that your design takes into account these parameters to minimize losses and ensure reliable operation.
  • To handle ESD protection, follow proper handling and storage procedures for the device. Use ESD-safe materials, such as wrist straps, mats, and bags, and ensure that your PCB design includes ESD protection components, such as TVS diodes or ESD arrays, as needed.

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TPSMP22AHM3_A/H Overview

Use the download button to access the TPSMP22AHM3_A/H 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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