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TQP3M9018 - Qorvo

Description: High Linearity LNA Gain Block ,50 Ohm ,20 to 4000 MHz ,1.3 dB noise figure @ 1900 MHz ,3 x 3 mm QFN package ,+5 V single supply, 85 mA current.

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Symbol
TQP3M9018 - Qorvo - PCB symbol
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PCB Footprints
TQP3M9018 - Qorvo PCB footprint - Other - Other - TQP3M9018
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3D Models
TQP3M9018 - Qorvo - 3D model - Other - TQP3M9018
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TQP3M9018 Details

  • Manufacturer Part Number:

    TQP3M9018

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A991.B

  • Manufacturer:

    Qorvo

  • YTEOL:

    7.03

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    19 dB

  • Input Power-Max (CW):

    23 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    4000 MHz

  • Operating Frequency-Min:

    50 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Supply Current-Max:

    100 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

TQP3M9018 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize radiation. A via-stitched ground plane under the device is also recommended to reduce electromagnetic interference (EMI).
  • Use a Smith chart or a network analyzer to optimize the input and output matching networks for maximum power transfer and minimum reflection. The device's input and output impedances should be matched to 50 ohms for optimal performance.
  • A heat sink or thermal pad is recommended to dissipate heat generated by the device. The device's thermal pad should be connected to a solid ground plane to improve thermal conductivity. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • The device should be biased according to the recommended operating conditions specified in the datasheet. The gate voltage (Vgs) should be set to the recommended value, and the drain voltage (Vds) should be set to the minimum required value to ensure optimal performance.
  • Key considerations for ensuring the reliability of the TQP3M9018 include operating the device within the recommended operating conditions, avoiding electrical overstress, and ensuring proper thermal management. The device should also be handled and stored according to the recommended procedures to prevent damage.

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TQP3M9018 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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