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TQP3M9019 - Qorvo

Description: RF Amplifier .05-4GHz P1dB= 22dB Gain 26.4dB 5Volts

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Symbol
TQP3M9019 - Qorvo - PCB symbol
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PCB Footprints
TQP3M9019 - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 Pin 3 x3 mm QFN Package16 Pin 3 x3 mm QFN
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3D Models
TQP3M9019 - Qorvo - 3D model - Quad Flat No-Lead - 16 Pin 3 x3 mm QFN Package16 Pin 3 x3 mm QFN
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TQP3M9019 Details

  • Manufacturer Part Number:

    TQP3M9019

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A991.B

  • Manufacturer:

    Qorvo

  • YTEOL:

    7.03

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    20 dB

  • Input Power-Max (CW):

    23 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    4000 MHz

  • Operating Frequency-Min:

    50 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Supply Current-Max:

    150 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

TQP3M9019 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize radiation. A via-stitched ground plane under the device is also recommended to reduce electromagnetic interference (EMI).
  • Use a Smith chart or a network analyzer to optimize the input and output matching networks for maximum power transfer and minimum reflection. The device's input and output impedances should be matched to 50 ohms for optimal performance.
  • A heat sink or thermal pad is recommended to dissipate heat generated by the device. The device's thermal pad should be connected to a solid ground plane to improve thermal conductivity. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • The device should be biased according to the recommended operating conditions specified in the datasheet. The gate voltage should be set to the recommended value, and the drain voltage should be set to the desired operating voltage. The device's current should be monitored to prevent overheating.
  • The device should be operated within the recommended operating conditions specified in the datasheet. The device should be protected from electrostatic discharge (ESD) and overvoltage conditions. The device's junction temperature should be monitored to prevent overheating.

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TQP3M9019 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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