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TRF371109IRGZT - Texas Instruments

Description: Texas Instruments TRF371109IRGZT, Up-Down Converter & Mixer Circuit Gain=48.7 dB 4.5 → 5.5 V 48-Pin VQFN

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TRF371109IRGZT - Texas Instruments - PCB symbol
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PCB Footprints
TRF371109IRGZT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048D
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3D Models
TRF371109IRGZT - Texas Instruments - 3D model - Quad Flat No-Lead - RGZ0048D
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TRF371109IRGZT Details

  • Manufacturer Part Number:

    TRF371109IRGZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TRF371109IRGZT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize coupling. Use a common-mode choke or a ferrite bead to filter the input power.
  • Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate in high-temperature environments. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
  • Critical components include the input capacitor (Cin), output capacitor (Cout), and the inductor (L). Choose components with low ESR and high ripple current ratings to ensure stability and efficiency.
  • Use an oscilloscope to monitor the input and output waveforms. Check for proper PCB layout, decoupling, and component selection. Verify the input voltage and current ratings are within specifications. Consult the datasheet and application notes for troubleshooting guidelines.
  • The TRF371109IRGZT is a commercial-grade device, but Texas Instruments offers a space-grade version, the TRF371109IRGZTQ1, which is qualified for high-reliability applications. Consult the datasheet and Texas Instruments' documentation for specific requirements and certifications.

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TRF371109IRGZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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