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TRF6900APTG4 - Texas Instruments

Description: RF Transceiver Sgl-Chip RF Transmitter

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TRF6900APTG4 - Texas Instruments - PCB symbol
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PCB Footprints
TRF6900APTG4 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PT (S-PQFP-G48
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3D Models
TRF6900APTG4 - Texas Instruments - 3D model - Quad Flat Packages - PT (S-PQFP-G48
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TRF6900APTG4 Details

  • Manufacturer Part Number:

    TRF6900APTG4

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    GREEN, PLASTIC, LQFP-48

  • Pin Count:

    48

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    60 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TRF6900APTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TRF6900APTG4 evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The TRF6900APTG4 can be configured for different frequency bands using the SPI interface to program the device's registers. The specific configuration depends on the desired frequency band and application, and can be found in the device's programming guide.
  • The TRF6900APTG4 can handle up to 30 dBm of output power, but the actual power handling capability depends on the specific application, PCB layout, and thermal management. It's essential to follow the recommended design guidelines and thermal management techniques to ensure reliable operation.
  • Impedance matching is critical for optimal performance. Texas Instruments provides guidelines for impedance matching in the device's datasheet and application notes. Engineers can use simulation tools like ADS or AWR to design and optimize the matching network.
  • Thermal management is crucial for the TRF6900APTG4, as high temperatures can affect performance and reliability. Key considerations include using a heat sink, thermal vias, and thermal pads, as well as ensuring good airflow and avoiding thermal hotspots.

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TRF6900APTG4 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like TRF69, or try a keyword search, such as Cellular Telephone Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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