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TS1874IYPT - STMicroelectronics

Description: 1.8 V input/output, rail-to-rail, low power operational amplifiers

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TS1874IYPT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14  HEIGHT 1.2
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TS1874IYPT - STMicroelectronics  - 3D model - Small Outline Packages - TSSOP14  HEIGHT 1.2
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TS1874IYPT Details

  • Manufacturer Part Number:

    TS1874IYPT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, TSSOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.15 µA

  • Bias Current-Max (IIB) @25C:

    0.125 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.06 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    14

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    0.38 V/us

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1700

  • Voltage Gain-Min:

    3162

  • Wideband:

    NO

  • Width:

    4.4 mm

TS1874IYPT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS1874IYPT should include a solid ground plane, wide power traces, and a thermal relief pattern around the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure stable operation with a single-supply voltage, it's essential to decouple the power supply with a 10uF capacitor and a 100nF capacitor in parallel, placed as close to the device as possible. Additionally, a 1uF capacitor should be connected between the VCC and GND pins.
  • The recommended input impedance for the audio signal is between 1kΩ and 10kΩ. This ensures optimal signal-to-noise ratio and prevents signal attenuation.
  • To minimize EMI and RFI emissions, use a shielded enclosure, keep the device away from other noise-sensitive components, and use a common-mode choke or ferrite bead on the output lines. Additionally, ensure that the PCB layout is optimized for minimal radiation.
  • The maximum allowed power dissipation for the TS1874IYPT is 1.4W. Exceeding this limit can cause the device to overheat and potentially fail. Ensure that the device is properly heat-sinked and that the PCB layout is optimized for thermal performance.

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TS1874IYPT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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