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TS27M2BIDT - STMicroelectronics

Description: STMicroelectronics TS27M2BIDT, Dual CMOS Op Amp, 1MHz, 3 → 16 V, 8-Pin SOIC

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TS27M2BIDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 package-.
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TS27M2BIDT Details

  • Manufacturer Part Number:

    TS27M2BIDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MICRO, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.3 V/us

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

TS27M2BIDT Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the TS27M2BIDT is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 150°C.
  • To ensure proper power supply, connect the VCC pin to a stable 2.7V to 5.5V power source, and the GND pin to a reliable ground connection. Additionally, it's recommended to use a decoupling capacitor (e.g., 100nF) between VCC and GND to filter out noise and ensure stable operation.
  • The TS27M2BIDT supports a maximum data transfer rate of 400 kbps in I2C mode and 1 Mbps in SPI mode, as specified in the datasheet.
  • To enter power-down mode, set the SHDN pin to a logic low level. In this mode, the device consumes minimal power (typically <1 μA). When exiting power-down mode, ensure the SHDN pin is set to a logic high level and wait for the device to stabilize (typically <10 ms) before resuming normal operation.
  • The internal pull-up resistors on the SCL and SDA pins are designed to simplify the design and reduce the number of external components required. These resistors are typically 10 kΩ and can be disabled by connecting an external pull-up resistor to the pins.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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