TS27M2CN footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

TS27M2CN - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP8_

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Datasheet Download Datasheet
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Part Number TS27M2CN
Manufacturer STMicroelectronics
Pin Count 8
Part Category Integrated Circuit
Package Category Dual-In-Line Packages
Footprint Name Dual-In-Line Packages - DIP8_
Released Date Apr 9, 2026
Last Modified Date Apr 9, 2026 11:44 AM UTC
Pinout / Pin List Click Here (Member Only)

TS27M2CN Details

Manufacturer Part Number:
TS27M2CN
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
DIP
Package Description:
ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count:
8
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
STMicroelectronics
YTEOL:
4.45
Amplifier Type:
OPERATIONAL AMPLIFIER
Architecture:
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB):
0.00015 µA
Common-mode Reject Ratio-Min:
65 dB
Common-mode Reject Ratio-Nom:
80 dB
Frequency Compensation:
YES
Input Offset Voltage-Max:
12000 µV
JESD-30 Code:
R-PDIP-T8
JESD-609 Code:
e3
Length:
9.27 mm
Low-Bias:
YES
Low-Offset:
NO
Micropower:
YES
Number of Functions:
8
Number of Terminals:
2
Operating Temperature-Max:
70 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
DIP
Package Equivalence Code:
DIP8,.3
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Packing Method:
TUBE
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
5.33 mm
Slew Rate-Min:
0.3 V/us
Slew Rate-Nom:
0.6 V/us
Supply Current-Max:
0.5 mA
Supply Voltage Limit-Max:
18 V
Supply Voltage-Nom (Vsup):
10 V
Surface Mount:
NO
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
MATTE TIN
Terminal Form:
THROUGH-HOLE
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL
Unity Gain BW-Nom:
1000
Voltage Gain-Min:
20000
Wideband:
NO
Width:
7.62 mm

TS27M2CN Frequently Asked Questions (FAQs)

STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within the recommended temperature range.
Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, regardless of the supply voltage (VCC). Exceeding this voltage may cause damage to the device.
STMicroelectronics recommends implementing ESD protection measures, such as using ESD diodes or transient voltage suppressors (TVS) on the input lines, to prevent damage from electrostatic discharge. Additionally, follow proper handling and storage procedures to minimize the risk of ESD damage.
To ensure proper operation, it's recommended to power up the device in the following sequence: VCC, then input signals. This sequence helps prevent latch-up and ensures that the device operates correctly.

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TS27M2CN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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